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surface-mount technology

Method for producing electronic circuits

EntityQ191042

Also known as SMT · surface-mount device · surface-mount components

Subclass of: mechanical assembly
, Surface-mount technology
Part of: electronics

Overview

From Wikipedia, the free encyclopedia · Read full article · Text CC BY-SA 4.0

Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.

Overview

All data

21 statements · 19% with external sources · numbers in brackets are citations

Product or material produced: electronic circuit
SMD
electronic component
Opposite of: through-hole technology
Different from: simultaneous multithreading
Immediate cause of: creation product or material produced: SMD
development class of object(s) of occurrence: SMD

On other databases

11 identifiers linking surface-mount technology across the web's reference databases

Data quality

statements

19%

externally sourced

Source last edited June 1, 2026. AIDB refreshes this page daily.

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AIDB. (2026). surface-mount technology (Q191042). Retrieved from https://aidb.si/e/surface-mount-technology-Q191042