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multi-chip module

Discrete electronic assembly containing multiple integrated circuits that behaves as a unit

Entityjoining technology integrated circuit packaging typeQ1466268

Also known as MCM · multichip module · multi-chip package · multichip package

Instance of: joining technology
, integrated circuit packaging type
Subclass of: hybrid integrated circuit
, semiconductor package
, component

Overview

From Wikipedia, the free encyclopedia · Read full article · Text CC BY-SA 4.0

A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits, semiconductor dice and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.

Overview

All data

16 statements · 19% with external sources · numbers in brackets are citations

Members / parts: chiplet quantity: 2 · sourcing circumstances: minimum · nature of statement: defining quality
printed circuit board nature of statement: often
passive electronic component nature of statement: often
interposer nature of statement: often
Fabrication method: advanced packaging

On other databases

7 identifiers linking multi-chip module across the web's reference databases

Data quality

statements

19%

externally sourced

Source last edited October 5, 2026. AIDB refreshes this page daily.

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AIDB. (2026). multi-chip module (Q1466268). Retrieved from https://aidb.si/e/multi-chip-module-Q1466268