ball grid array
Type of surface-mount packaging
EntityQ570628
Also known as bga
- Subclass of
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3 identifiers linking ball grid array across the web's reference databases
Type of surface-mount packaging
Also known as bga
3 identifiers linking ball grid array across the web's reference databases
From Wikipedia, the free encyclopedia · Read full article · Text CC BY-SA 4.0
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.